TSOP
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TSOP
The acronym TSOP can stand for several things:

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tsop

tsop
thin small outline package (dram, ic)



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TSOP(Thin Small Outline Package)
薄型小尺寸封装。
20世纪80年代出现。TSOP内存是在芯片的周围做出引脚,采用SMT技术(表面安装技术)直接附着在PCB板的表面。TSOP封装外形尺寸时,寄生参数(电流大幅度变化时,引起输出电压扰动)减小,适合高频应用,操作比较方便,可靠性也比较高。同时TSOP封装具有成品率高,价格便宜等优点,因此得到了极为广泛的应用。
TSOP封装方式中,内存芯片是通过芯片引脚焊接在PCB板上的,焊点和PCB板的接触面积较小,使得芯片向PCB办传热就相对困难。而且TSOP封装方式的内存在超过150MHz后,会产品较大的信号干扰和电磁干扰。

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TSOP
Thin Small Outline Packaging (DRAM)

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TSOP
Thin Small-Outline Package


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