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TSOP
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TSOP
The acronym TSOP can stand for several things:
- In electronics, thin small-outline packages are a type of surface mount technology
- The song "TSOP (The Sound of Philadelphia)", is the theme song for the American television music program Soul Train, and a 1974 hit single by the band MFSB
- TSOP Records, a subsidiary of Philadelphia International Records, named after the hit MFSB song
- The 1998 Death album, The Sound of Perseverance
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tsop
tsop
thin small outline package (dram, ic)
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TSOP(Thin Small Outline Package)
薄型小尺寸封装。
20世纪80年代出现。TSOP内存是在芯片的周围做出引脚,采用SMT技术(表面安装技术)直接附着在PCB板的表面。TSOP封装外形尺寸时,寄生参数(电流大幅度变化时,引起输出电压扰动)减小,适合高频应用,操作比较方便,可靠性也比较高。同时TSOP封装具有成品率高,价格便宜等优点,因此得到了极为广泛的应用。
TSOP封装方式中,内存芯片是通过芯片引脚焊接在PCB板上的,焊点和PCB板的接触面积较小,使得芯片向PCB办传热就相对困难。而且TSOP封装方式的内存在超过150MHz后,会产品较大的信号干扰和电磁干扰。
20世纪80年代出现。TSOP内存是在芯片的周围做出引脚,采用SMT技术(表面安装技术)直接附着在PCB板的表面。TSOP封装外形尺寸时,寄生参数(电流大幅度变化时,引起输出电压扰动)减小,适合高频应用,操作比较方便,可靠性也比较高。同时TSOP封装具有成品率高,价格便宜等优点,因此得到了极为广泛的应用。
TSOP封装方式中,内存芯片是通过芯片引脚焊接在PCB板上的,焊点和PCB板的接触面积较小,使得芯片向PCB办传热就相对困难。而且TSOP封装方式的内存在超过150MHz后,会产品较大的信号干扰和电磁干扰。
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TSOP
Thin Small Outline Packaging (DRAM)
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TSOP
Thin Small-Outline Package
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