Through-hole technology, also spelled "thru-hole", refers to the mounting scheme used for
electronic components that involves the use of
pins on the components that are inserted into holes drilled in
printed circuit boards (PCB) and
soldered to pads on the opposite side.While through-hole mounting provides strong mechanical bonds when compared to
surface-mount technology techniques, the additional drilling required makes the boards more expensive to produce. They also limit the available routing area for
signal traces on layers immediately below the top layer on multilayer boards since the holes must pass through all layers to the opposite side. To that end, through-hole mounting techniques are now usually reserved for bulkier components such as
electrolytic capacitors or
semiconductors in larger packages such as the
TO220 that require the additional mounting strength.
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