A probe card is an interface between an electronic test system and a
semiconductor wafer. Its purpose is to provide an electrical path between the test system and the circuits on the wafer, thereby permitting the testing and validation of the circuits at the wafer level, usually before they are diced and packaged. It consists, normally, of a
printed circuit board (PCB) and some form of contact elements, usually metallic, but possibly of other materials as well. Probe cards are broadly classified into needle type, vertical type, and
MEMS(Micro Electro-Mechanical System)type depending on shape and forms of contact elements. MEMS type is the most advanced technology currently available. The most advanced type of probe card currently can test an entire 12"
wafer with one touchdown. Normally a probe card is inserted into an equipment called a
Wafer prober, inside which position of the wafer to be tested will be manipulated so that there should be a precise contact between the probe card and wafer.
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a card that hold a number of tiny needles with specific spacings designed to make contact with bond pads so that die can be tested in wafer form.