Physical Vapor Deposition

Physical vapor deposition (PVD) is a general term used to describe any of a variety of methods to deposit thin films by the condensation of a vaporized form of the material onto various surfaces (e.g., onto semiconductor wafers). The coating method involves purely physical processes such as high temperature vacuum evaporation or plasma sputter bombardment rather than a involving a chemical reaction at the surface to be coated as in chemical vapor deposition. The term physical vapor deposition appears originally in the 1966 book “Vapor deposition” by CF Powell, JH Oxley and JM Blocher Jr but Michael Faraday was using PVD to deposit coatings as far back as 1838.
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a process where a film is deposited on a wafer by a physical process, for example, evaporation or sputtering.

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