Dual In Line Package

type of memory chip with dual rows of connecting pins on two sides, DIP (Computers)

In microelectronics, a dual in-line package (DIP), sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins, usually protruding from the longer sides of the package and bent downward. A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14.
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An electronic package with a rectangular housing and a row of pins along each of two opposite sides. Note: DIP packages may be used for integrated circuits, or for discrete components, such as resistors or toggle switches. An example of a DIP is a microcircuit package with two rows of seven vertical leads that is specially designed for mounting on a printed circuit board.

<hardware> (DIL, DIP) The most common type of package for small and medium scale integrated circuits, with up to about 48 pins. The pins hang vertically from the two long edges of the rectangular package, spaced at intervals of 0.1 inch. The pins fit through holes in the circuit board to which they are soldered or into a socket.
[More than 48 pins?]
(1995-02-06)

Dual In Line Package (DIP) - an older style integrated circuit package with two parallel rows of pins designed to be inserted through holes in a printed circuit board. DIPs still account for approximately 13% of Package types shipped on a unit shipment basis. The use of DIPs is declining.