Collimated Sputtering

a sputtering process where the arrival of metal is at an angel normal to the wafer surface. The metal may be collimated by a thick honeycomb grid that blocks off angle metal atoms or by ionizing the metal atoms and attracting them towards the wafer. Collimated sputtering improves filling of high aspect ratio contacts. Colloidal Matter - particles with sizes of 1 to 200 nanometers in size.