Chemical Vapor Deposition

Chemical vapor deposition (CVD) is a chemical process used to produce high-purity, high-performance solid materials. The process is often used in the semiconductor industry to produce thin films. In a typical CVD process, the wafer (substrate) is exposed to one or more volatile s, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile byproducts are also produced, which are removed by gas flow through the reaction chamber.
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a process whereby a film is deposited by reacting chemicals together in the gaseous or vapor phase to form a film. The gases or vapors utilized for CVD are compounds that contain the element to be deposited and that may be induced to react with a substrate or other gas(es) to deposit a film. The CVD reaction may be thermally activated, plasma induced, plasma enhanced CVD or activated by light in photon induced CVD. See also, Atmospheric Chemical Vapor Deposition, Low Pressure Chemical Vapor Deposition, Metal Organic Chemical Vapor Deposition, Photo Enhanced Chemical Vapor Deposition.