Chemical Mechanical Polishing
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Chemical-mechanical planarization
Chemical-mechanical planarization or Chemical-mechanical
polishing
, commonly abbreviated CMP, is a technique used in
semiconductor
fabrication
for
planarizing
the top surface of an in-process semiconductor
wafer
or other substrate.
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Integrated Circuit Dictionary
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Chemical Mechanical Polishing
an older terminology for
Chemical Mechanical Planarization
.
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