etching solution used to etch
aluminum. Typically
aluminum etches are based on
phosphoric acid. A common aluminum etch formula would be phosphoric acid, H3PO4, 80ml,
nitric acid, HNO3, 5ml, and water, H2O, 15ml
acetic acid, CH3COOH, will sometimes be added as a buffer. Aluminum etches evolve
hydrogen bubbles that may cling to the
aluminum layer being etched locally preventing
etching, and leaving behind
aluminum residue, "snow". Some mechanism such as agitation or low pressure must be supplied to remove
hydrogen bubbles.
Surfactants may also be used to enhance
wetting.